IC Packaging Service

IC Packaging Service

Standard Systems is the service provider of turnkey based semiconductor assembly providing following services.

• 1) Consult IC Packaging
• 2) Find cost effective IC Packaging
• 3) Locate sub-contractors for actual IC Packaging.
• 4) Involve Engineering & production related follow-up.
• 5) Communicate very closely between customers and sub-contractors.
• 6) Supply finished packages to customers directly or by drop shipment.

Standard Systems has connections with qualified sub-contractors which are located in Korea and other Asian area. Standard Systems provides services with solution that meet our customer's budget and size objectives.

• Laminate Substrate BGA PBGA FBGA
• Quad Flat No-Lead packages QFN/DFN/MLF
• Quad Flat Packages MQFP/ w Drop-In Heat Spreader LQFP/ExposedPad LQFP TQFP/ExposedPad TQFP PLCC
• Dual-In-Line Packages TSOP(I)/ TSOP(II)/ TSSOP/ExposedPad TSSOP SOIC/ExposedPad SOIC/ Power SOP SSOP/ExposedPad SSOP/Power SSOP SOJ/ PDIP/SDIP
• Discrete Packages DPAK/ D2PAK/SOT
• Others Dummy BGA molded Substrates Dummy QFN molded lead frame

Note : Dummy IC(Dummy Components, Mechanical IC) are not electrical functional parts, and used for machine set-up, acceptance and demonstration of pick and place equipment, educational training, evaluation of solder pastes, SMT processes and printed circuit board rework. Daisy Chain and standard dummy components are available.